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半导体产业报告
全球集成电路封装材料市场预测报告—2013/2014 版
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出自:SEMI

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全球半导体封装材料市场展望报告全面调研了半导体封装工艺趋势记忆其对封装材料市场的影响。本报告就2013年封装材料市场的新机遇、新展望全面展现。

该报告为您更好的了解封装市场提供了很有价值的数据资料。封装材料将直接影响到半导体设备器件的性能、可靠性及成本,同时也会大力改善其潜在性能。

内容包括:
• 有机基板
• 引线框架
• 塑封模
• 键合丝
• 填充材料
• 晶圆粘合剂
• 液态封装材料
• 锡球
• 晶圆级封装电介质
• 热介面材料

特写:
• 工艺趋势
• 地区市场规模
• 五年内市场预测
• 供应商市场份额
• 市场规模(按营收和单位)
• 产能利用趋势
• 平均销售价格及趋势

电子版包括:
• 简要执行摘要
• 每章节Adobe Acrobat格式
• 市场信息Excel格式
• PowerPoint图表

价格信息  

  多用户
SEMI会员 $10,000
非会员 $12,500

报告样本下载

Global Semiconductor Packaging Materials Outlook 2011/2012 Edition

Global Semiconductor Packaging Materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets. Packaging materials markets are quantified, new opportunities are highlighted, and forecasts through 2015 are presented.

Global Semiconductor Packaging Materials Outlook is an essential business tool for anyone interested in the plastic packaging materials arena. Packaging materials directly affect the performance, reliability and cost of semiconductors, and offer significant improvement potential.

Material segments covered include:
• Organic substrates
• Leadframes
• Mold compounds
• Bonding wire
• Underfill materials
• Die attach adhesives
• Liquid encapsulants
• Solder balls
• Wafer level package (WLP) dielectrics
• Thermal interface materials

Features:
• Technology trends
• Regional market size
• Five-year market forecast
• Supplier market share
• Market size in revenue and units
• Capacity and utilization trends
• Average selling prices and trends

This study has a user-friendly electronic format and includes:
• Concise executive summary
• Adobe Acrobat chapters for each materials segment
• Excel workbook file summarizing market information
• PowerPoint charts, ideal for presentations

Pricing Information
  Multi User
SEMI Member $10,000
Non-member  $12,500

 Sample Report Download

 

 

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文章收入时间: 2013-12-08
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