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半导体产业报告
SEMI Book-to-Bill 数据报告(每月更新)
出自:SEMI

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金鑫(86.21.60278553, ksin@semi.org

产业基准:跟踪北美总部的半导体设备制造商的订单出货数据。

SEMI Book-to-Bill年度报告将为您提供北美半导体设备制造商每月的订单出货数据,包括前道(硅片工艺、掩膜版、晶圆制造、Fab设备)及终端制造(测试、装配及封装)。Book-to-Bill报告以平均三个月的北美总部设备制造商的订单和出货数据为计算标准。北美地区的设备供应商代表着全球近50%的设备市场。若订单出货比大于1则代表着市场正在扩大,反之,市场缩小则小于1。

SEMI Book-to-Bill 报告
提供每月北美地区半导体设备制造商的订单出货数据,包括前道及终端制造设备。每月结束后的三星期发布。

价格信息
SEMI会员                    $295
非会员                         $395

报告样本下载

SEMI Book-to-Bill Report

A benchmark for the Industry: Tracks global billings and bookings of North American-headquartered manufacturers of semiconductor equipment

The SEMI Book-to-Bill annual subscription provides global bookings and billings by month for North American-based semiconductor equipment manufacturers. The data includes front-end (Wafer Processing, mask/Reticle, Wafer Mfg., Fab Facilities) and final manufacturing (Test, Assembly & Packaging). The Book-to-Bill report is calculated by taking a three-month moving average of North American headquartered equipment manufacturers bookings divided by a three-month average of billings for the same period of time. North American equipment suppliers represent approximately 50 percent of the worldwide equipment market. A Book-to-bill ratio above one represents an expanding market while a book-to-bill ratio below one represents a contracting market.

SEMI Book-to-Bill Report
Monthly global bookings and billings for North American-based semiconductor equipment manufacturers, including front-end and final manufacturing equipment. Delivered three weeks after the close of each month

Pricing Information
SEMI Member                                         $295
Non-member                                          $395

 Sample Report Download

 

 

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文章收入时间: 2011-02-15
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