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SEMI Book-to-Bill历史数据报告提供了从1991-2011年每月北美半导体设备制造商的订单出货数据。包括前道（硅片工艺、掩膜版、晶圆制造、Fab设备）及终端制造（测试、装配及封装）。
价格信息
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多用户 |
| SEMI会员 |
$1,875.00 |
| 非会员 |
$2,500.00 |
 报告样本下载
Historical Book-to-Bill Report (1991-2011)
The SEMI Historical Book-to-Bill provides global bookings and billings by month for North American-based semiconductor equipment manufacturers for the period from 1991 to 2008. The data includes front-end (Wafer Processing, Mask/Reticle, Wafer Manufacturing, Fab Facilities) and final manufacturing (Test, Assembly & Packaging).
Pricing Information
| |
Multi User |
| SEMI Member |
$1,875.00 |
| Non-member |
$2,500.00 |
Sample Report Download
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