SEMI Book-to-Bill历史数据报告提供了从1991-2011年每月北美半导体设备制造商的订单出货数据。包括前道(硅片工艺、掩膜版、晶圆制造、Fab设备)及终端制造(测试、装配及封装)。
价格信息
|
多用户 |
SEMI会员 |
$1,875.00 |
非会员 |
$2,500.00 |
报告样本下载
Historical Book-to-Bill Report (1991-2011)
The SEMI Historical Book-to-Bill provides global bookings and billings by month for North American-based semiconductor equipment manufacturers for the period from 1991 to 2008. The data includes front-end (Wafer Processing, Mask/Reticle, Wafer Manufacturing, Fab Facilities) and final manufacturing (Test, Assembly & Packaging).
Pricing Information
|
Multi User |
SEMI Member |
$1,875.00 |
Non-member |
$2,500.00 |
Sample Report Download
|