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SEMI CHINA技术委员会
SEMI CHINA技术委员会

Name

姓名

Title

Company

 Jintie Li

  李金铁

  Director, Technical Support

  Advantest

  Ruiping Wang

  王瑞萍

  Senior Director of Technology

  AMAT China

  Ken Wu

  伍强

  Field Application Manager, Lithography

  ASML

  Qingyuan Han

  韩清源

  Principal Scientist & Technology Manager, Asia

  Axcelis Technologies

  KuoChun Wu

  吴国俊

  Asia Pacific R&D Director

  Cabot Microelectronics

  Ran Liu

  刘冉

  Professor

  复旦大学

  Steve Yang

  TD Vice President

  GSMC

  S W Ricky Lee

  李世玮

   Director, EPACK Lab/CAMP

  香港科技大学(HKUST)

  Qinghuang Lin

 林庆煌

  Research Staff Member

  IBM Watson Research Centre

 Teng Gao

  高腾

  Business Development Manager

  IMEC

  Tianchun Ye

  叶甜春

  Deputy Director & Professor

  中科院微电子所

  Michale Wang

  汪晓辉

  TD Program Manager

  Intel

  Albert Yue

  余伟良

  Product Manager

  Kulicke & Soffa

  Chanpin Chong

  张赞彬

  GM, Strategic Business Dept

  KLA-Tencor China

  Jinrong Zhao

  赵晋荣

  Vice President

  北方微电子

  Jason Tian

  田晓明

  Director of Technology

  Novellus

  David P. Huang

  黄丕成

  Director of R&D

  Praxair

  Dennis Chun Ta Chen

  陈俊达

  GM, RHEM CMP Technologies

  Rohm and Haas

  Hanming Wu

  吴汉明

  Deputy Director

  SMIC

  Hans Xiao

  肖汉中

  Senior Director

  TEL

  Kevin Xia

  夏克金

  Service Support Manager

  Verigy

  Deren Yang

  杨德仁

  Deputy Director & Professor

  浙江大学

 

SEMI CHINA技术委员会成员名单介绍(按公司名称排序,截止到2007年11月30日)
 
Li JinTie 李金铁
Director, Technical Support Department
Advantest (Suzhou)
 

Mr. Li JinTie has nearly 10 years experience in advantaged semiconductor test area. He joined ADVANTEST China as Technical Director since 2004 in charge of Technical Support Department for testing application & customer support.

Prior to joining ADVANTEST China, Li jintie had 6 years R &D experience in ADVANTEST Japan on semiconductor testing technical and testing solution development.

Li jintie received Bachelor Degree in Applied Chemical Engineering from Tianjing University. He also studied in Electrical Engineering field in Zhejiang University for 2 years. He received a Master Degree in Electrochemical Synthesis field from the Yamanashi University, Yamanashi, Japan. The experience of work in Japan makes him precise, creativeness and even speaks fluent Japanese.

Dr. Ruiping Wang王瑞萍
Sr. Technology Director
Applied Materials China
 

Dr. Ruiping Wang has been a Senior Director of Technology at Applied Materials China for over 5 years with the responsibility of leading the technical group, as well as being the Deputy General Manager for SMIC account business unit in Applied Materials China.

Prior to joining Applied Materials China in 2002, Dr. Wang has worked in the Dielectric Etch Product Group in Applied Materials Inc in US for 7 years, during which Dr. Wang has filed 14 US patents. Before that, Dr. Wang has worked for Catalytica Inc. in Sunnyvale California for 2 years as a fellow chemist from 1993-1995.

Dr. Wang received her Ph.D degree in Solid State Physics in 1991 and worked as a postoc with Professor Arthur W Sleight on Solid State Chemistry, in 1991-1993, in Oregon State University, during which Dr. Wang has published 18 technical papers.


Dr. KuoChun Wu,吴国俊
Director of Technology Development
Cabot Microelectronics
 

Dr. KC Wu has served as Director of Technology development in Cabot Microelectronics since 2007. Prior to that, Dr. Wu held senior research and development management and technology positions at Ultratech, Semiconductor Manufacturing International Corporation (SMIC), Mosel-Vitelic, and Applied Materials. Dr. Wu holds a Ph.D. in Mechanical Engineering from Massachusetts Institute of Technology (M.I.T), and is currently studying an Executive M.B.A. program in China Europe International Business School (CEIBS) in Shanghai.


Prof. Ran Liu, 刘冉
Professor/Deputy Director
Micro/Nanoelectronics Science & Technology Platform
Fudan University
 

Dr. Ran Liu is a Changjiang Professor at Fudan University. Concurrently, he is the Deputy Director of the “Micro/Nanoelectronics Science and Technology Innovation Platform”, the only IC related R&D platform under Nation’s “985 Project”.

Dr. Liu received his B.S. Fudan University in 1982, his M.S. from Shanghai Institute of Technical Physics in 1985, and his Ph.D. from Max-Planck-Institute for Solid State Research, Germany, in 1990.

Prior to joining Fudan University, Dr. Liu worked for over 8 years at Motorola and was actively involved in numerous materials/device development, including high-k gate dielectrics, low-k/Cu interconnects, SiGe:C/Si HBT, strained Si channel, PDSOI and FDSOI CMOS, Si-dots nonvolatile memory, MRAM, and FRAM, and development of products related to wireless communication, consumer and automotive electronics.

Prior to his employment at Motorola, Dr. Liu was a research scientist at the University of Illinois at Urbana-Champaign, the University of Maryland, and the National Institute of Standard and Technology for about 6 years.

Prior to his employment at Motorola, Dr. Liu was a research scientist at the University of Illinois at Urbana-Champaign, the University of Maryland, and the National Institute of Standard and Technology for about 6 years.

Dr. Liu is also an adjunct professor at Arizona State University in United States and a visiting professor at Shanghai Institute of Technical Physics of Chinese Academy of Sciences.


Dr. Steve Yang
Vice President, Technology Development
Grace Semiconductor Manufacturing Corporation (GSMC)
 

Dr. Steve Yang is the Vice President of Technology Development (TD) of Grace Semiconductor Manufacturing Corporation (GSMC). His responsibility is for Technology Development activities include Logic Technology, High Voltage & Power Management Technology and Advance Process Development.

He received his Ph.D. degree in Electrical Engineering from University of Texas at Austin in 1985 and then joined to California Institute Technology (CIT) as a Research Fellow at Electrical Engineering Department. Dr. Yang became an Assistant Professor of Electrical Engineering at Mississippi State University. In 1988, He joined the Intel as Sr. process development engineer. In 1995, Dr. Yang joined to TSMC as Deputy Director of Technology. In 2003 Dr. Yang joined 1st Silicon as VP of Technology. He is response for technology development including Logic, Mixed Signal, High Voltage, Flash and e-Flash etc technologies.


Shi-Wei Ricky Lee, Ph.D., 李世玮
Director, EPACK Lab/CAMP
Center for Advanced Microsystems Packaging
Hong Kong University of Science and Technology
 

Dr. Ricky Lee has been Director of Electronic Packaging Laboratory (EPACK Lab) at the Hong Kong University of Science and Technology (HKUST) since 2000. Dr. Lee is in charge of research and development, education and training, industrial services and liaison. In addition to the EPACK Lab directorship, he has been a faculty member in the Department of Mechanical Engineering at HKUST since 1993. His R&D activities cover wafer level chip scale packaging, 3D packaging, LED packaging, through silicon vias and high density interconnects, lead-free soldering and solder joint reliability.

Dr. Lee received a Ph.D. degree in Aeronautical and Astronautical Engineering from Purdue University, West Lafayette, Indiana, U.S.A. and a M.S. degree in Engineering Mechanics from Virginia Polytechnic Institute & State University, Blacksburg, Virginia, U.S.A. He has substantial publications in international journals and conference proceedings. He also co-authored three technical books. Furthermore, he serves as Editor-in-Chief of IEEE Transactions on Components & Packaging Technologies and sits on the Editorial Advisory Board of two other international journals. Dr. Lee is very active in professional societies and international conferences. He is Fellow of Institute of Electrical & Electronics Engineers (IEEE), Fellow of American Society of Mechanical Engineers (ASME), and Fellow of Institute of Physics (IoP). He is also elected Distinguished Lecturer of IEEE Components, Packaging & Manufacturing Technology (CPMT) Society.


Dr. Qinghuang Lin,林庆煌
Research Staff Member
IBM T. J. Watson Research Center
 

Dr. Qinghuang Lin is a Research Staff Member at IBM T.J. Watson Research Center in Yorktown Heights, New York, USA. He has more than 10 years of experience in the semiconductor industry, all with IBM. He has held a variety of positions in semiconductor research, development, engineering and technology strategy for IBM's 512 MBit and 1 GBit DRAM technologies as well as IBM’s 0.25 um to 32 nm CMOS technologies. A frequent organizer and speaker of professional conferences, Dr. Lin is the editor of 2 books and 2 conference proceedings volumes and the author and co-author of over 50 technical papers. Dr. Lin has more than 25 issued and pending US patents. He is a recipient of 7 IBM Invention Achievement Awards. In 2002, he received an IBM Research Achievement Award for “invention, development and implementation of 248 nm bilayer resist technology in manufacturing.” Dr. Lin was also a member of the IBM team that helped win 2004 US National Medal of Technology -- the highest honor awarded by the President of the United States to America’s leading innovators.

A member of AAAS, ACS, MRS and SPIE, Dr. Lin currently serves on the Materials Secretariat of the American Chemical Society (ACS) and the Executive Committee of the American Chemical Society: Polymeric Materials Science and Engineering division. He also served on the Executive Committee of the SPIE Advanced Lithography Symposium and is the past chairman of the SPIE Resist Conference. In addition, he is a member of two engineering honor societies: Tau Beta Pi and Alpha Sigma Mu. Dr. Lin received his B.E. and M.S. degrees from Tsinghua University, Beijing, China and his Ph.D. degree from the University of Michigan, Ann Arbor, Michigan, USA. He was a post-doctoral fellow at the University of Texas at Austin prior to joining IBM.


Dr. Teng Gao, 高腾
Asia Liaison Manager
IMEC
 
Teng Gao, Ph.D. has been Asia Liaison Manager position at IMEC for 7 years with responsibility of business development in Asia, which includes marketing, contract negotiation, and project coordination for technology transfer, technology cooperation and training.

Teng Gao received a E.E. Master degree from Katholieke Universiteit Leuven (ESAT), Leuven, Belgium and a Ph.D. degree in Semiconductor from Katholieke Universiteit Leuven (IMEC), Leuven, Belgium. He is author or co-author of more than 20 refereed technical publications.


Michael Wang, 汪晓辉
Project Manager
Project Manager
Intel
 

Michael Wang, Ph.D. has been pathfinding integrator at FPTD Intel for one year. Michael’s responsible for flash memory related product packaging technology exploration, especially for cellular products. He has developed spacerless films to replace the silicon spacer for stack package height reduction. Prior to this position, Michael was the Intel Assembly TD at Shanghai material group manager since 2004.

Prior to joining Intel Company, Michael was a research fellow at National Institute of Standards and Technology at Maryland, USA. During his 2 years at NIST, Michael has worked on photo resist dissolution fundamentals through combinational method and advanced technologies such as neutron scattering.

Michael received a Ph. D degree in polymer chemistry and physics from the Chinese University of Hong Kong. His Ph. D thesis was about the polymer phase transition study by light scattering.

Zhao Jinrong赵晋荣
Executive Vice President
Beijing North Microelectronics Co.,Ltd(北方微电子)
 

Mr. Zhao Jinrong has been Vice President at North Microelectronics Company since 2003 with participating and contributing to the development and evolution of corporate vision, strategy, goals and objectives and overseeing their executions and implementation, directing divisions of Sales, Marketing, purchasing, manufacturing, QA&QC and IP.

Prior to joining North Microelectronics Company, Zhao was Vice President for Beijing Sevenstar Huachuang Electronic Co., Ltd. During his ten years at Sevenstar. Zhao spent time directing divisions of Sales & Marketing and product strategy planning.

Zhao received his Bachelor Degree in Mechanics & Electronics field from Xi’an Science & Technology University, and MBA from the Capital University of International Business &Economics in Beijing. Mr. Zhao has been awarded for his outstanding contributions in Programs for Science and Technology Development by China government.

Jason Tian, 田晓明
Director of Technology
Novellus Systems
 

Jason Tian has been Director of Technology position at Novellus Systems, Inc. since September, 2006. Jason is responsible for Novellus China region technology and business development. Jason joined Novellus in December 1994. He has held various process development and management positions at Novellus San Jose, CA and Novellus Tualatin, OR. Jason holds a bachelor's degree in Electron Physics from South China Institute of Technology and a master's degree in Electrical Engineering from Northeastern University in Boston, MA, and has completed his Ph.D. coursework in Electrical Engineering at Northeastern University in Boston, MA.

Throughout his employment with Novellus, Jason has gained in-depth knowledge of Novellus' PECVD, HDP and Tungsten technologies and has earned the trust and respect from Asia customers. Jason is a key contributor to Novellus’ worldwide success in PECVD FSG and N2 free ARL businesses. Jason has authored or coauthored more than 20 publications and several invited speaking engagement, including international symposiums. He had 8 US patents. Jason’s research efforts include the development and characterization of low-k dielectric and low-k SiC materials.


Dr. David Huang, 黄丕成 博士
Praxair Inc,Director of CMP R&D
 

Dr. David Huang is currently working for Praxair as the Director of CMP R&D. He has more than 10 year experience in semiconductor manufacturing CMP process / consumable / integration / management from Intel (computer chip maker), Seagate (hard drive industrial leader) and Praxair (materials and process gases). He also worked as a researcher for Materials Science Institute in Italian Academy of Science and University of California at Berkeley.

Dr. Huang received his PhD in Materials Science & Applied Surface Chemistry from University of California at Berkley and completed a management program sponsored by CSIRO/BHP in Sydney, Australia. He was the winner of IAA 2000 (Intel Achievement Award). He holds several patents in new materials, magnetic thin film head design and new polymer chemistry world wide, published papers in prestigious journals, gave seminars to universities and invited talks to international conferences. He also served as a chairman of several international conferences for semiconductor industry.

Hans Xiao,肖汉中
Senior Director,TEL上海
 

Hans Xiao is a Senior Director of Tokyo Electron (Shanghai) Limited, responsible for etch business and process engineering. He was a senior staff and manager for process development and integration at Lam Research from 2001 to 2006. He also worked as a senior engineer, staff engineer, and senior staff engineer at Applied Materials from 1994 to 2001. With Applied, he experienced a variety of technologies such as Metal CVD, Dielectric CVD, Metal Etch, Dielectric Etch, and Cu Module Integration. He holds a Ph.D. degree in Materials Science and Engineering from University of Illinois at Champaign-Urbana, USA.


Kelvin Xia
Service & Support Manager
Verigy, China
 

Currently Dr. Kelvin Xia is the Service and Support Manager for Verigy in China. He took the same position in Agilent since May 2005 before Verigy was spun-off from Agilent in June 2006.

In 1990, he received his PhD. from Tsinghua University majored in Electric Engineering with emphasizing on Microwave Technology and Electromagnetic Field Theory.

After his PhD. study, Dr. Xia focused his research and development on Artificial Intellectual and Machine Translation for couple years. Then he entered into the semiconductor industry. Over the past thirteen years, Dr. Xia has possessed different experience in application development, technical support, sales and marketing, as well as strategic management within the industry.

Prof. De-ren YANG
Service & Deputy Director
State Key Lab of Silicon Materials
Zhejiang University
 

After getting his Ph.D. degree in 1991, Deren Yang was a lecturer in the State Key Lab of Silicon Materials. In 1993 he worked in the Institute for Material Research at Tohoku University in Japan as a visiting researcher and then was promoted an associate professor at Zhejiang University. Since 1995, he had worked in the Institute for Experimental Physics at Technical Bergacademie University of Freiberg in Germany. In 1997 he was specially promoted a full professor at Zhejiang University. In 1998 he came back China to work in the State Key Lab of Silicon Materials. In 2000 he was promoted to be the Cheung Kong Professor by the Department of Education of China. In 2002 he won the National Science Fund for Distinguished Young Scholars.

He and his co-workers have authored four books and over 250 research papers in international journals. He also received 24 patents. He won the Second Prize of National Natural Science in 2005 and the 9th Chinese Science and Technology Award for Young Scientist. He was also the committee members of more than 10 international conferences and has given 14 invited talks in international conferences.

 
 
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